We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for CPU Module.
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CPU Module Product List and Ranking from 25 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated: Aggregation Period:Feb 04, 2026~Mar 03, 2026
This ranking is based on the number of page views on our site.

CPU Module Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Feb 04, 2026~Mar 03, 2026
This ranking is based on the number of page views on our site.

  1. Suntex Co., Ltd. Shizuoka//Industrial Electrical Equipment
  2. SECO S.p.A Italy//Industrial Electrical Equipment
  3. ADLINKジャパン 東京本社 Tokyo//Industrial Electrical Equipment
  4. 4 ナセル Tokyo//Industrial Electrical Equipment
  5. 5 アットマークテクノ Hokkaido//Electronic Components and Semiconductors

CPU Module Product ranking

Last Updated: Aggregation Period:Feb 04, 2026~Mar 03, 2026
This ranking is based on the number of page views on our site.

  1. NXP i.MX95 OSM CPU module OSM-IMX95 Suntex Co., Ltd.
  2. Ryzen COM Express CPU Module Type 7 Suntex Co., Ltd.
  3. NXP i.MX93 OSM CPU Module OSM-IMX93 Suntex Co., Ltd.
  4. Armadillo-610 アットマークテクノ
  5. 4 CPU module "SMARC" [LEC-ALN] ADLINKジャパン 東京本社

CPU Module Product List

1~30 item / All 194 items

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Multi-Flex Series Embedded Compact CPU Module

High performance condensed into card size! Equipped with various interfaces.

The "Embedded Compact CPU Module" is a board computer equipped with a processor characterized by high speed, low power consumption, and low cost, based on ARM core technology, supporting a wide range of applications from consumer to industrial and automotive. By separating the CPU board and the carrier board, it greatly contributes to reducing development costs and time. 【Features】 ■ High performance condensed into card size ■ Equipped with various interfaces ■ Various OS and evaluation drivers available ■ High speed, low power consumption, low cost ■ Greatly contributes to reducing development costs and time *For more details, please refer to the PDF materials or feel free to contact us.

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Argon Corporation Rugged CPU Unit for Installation ACB100

Compact, lightweight, power-efficient rugged CPU unit. Ideal for installation in aircraft, drones, and defense vehicles! Compliant with MIL-STD-810 and 461.

Argon is an American company that designs and manufactures displays and PCs ranging from 5 to 43 inches for military applications. They specialize in customization of MIL connectors, switch placements, and button locations. Their products comply with military standards MIL-STD-810, MIL-STD-461, and MIL-STD-901, boasting environmental performance with an operating temperature range of -10 to +55°C. An operating temperature option down to -40°C is also available. ■ Japanese technical documentation on MIL-STD-810, MIL-STD-461, and IP standards is available. If you would like to see it, please contact sales@nacelle.co.jp ■

  • Industrial PCs
  • CPU Module

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MilDef Corporation Rugged CPU Unit Mobilite7

Complies with MIL-STD-810, MIL-STD-461, and IP54. Operates at -20°C, rugged monitor-less CPU unit Mobilite7.

Custom proposals are possible with environmentally resistant connectors that guarantee waterproofing during connector mating. The CPU unit Mobilite7 from MilDef, a robust standard manufacturer with numerous overseas achievements and a proven track record in domestic defense applications, offers a variety of options and supports various customizations, including compatibility with MIL connectors for waterproof mating. This is the best solution that can respond widely and flexibly to customer requests! We have demo units available, so please feel free to contact us. ■ Japanese technical documents for MIL-STD-810, MIL-STD-461, and IP standards are available. If you would like to see them, please contact sales@nacelle.co.jp ■

  • MIlDef_Docklite-S.jpg
  • MIlDef_Docklite-2.jpg
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  • Industrial PCs
  • CPU Module

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IBASE Industrial ETX CPU Module ET839

Atom E3845 1.91GHz equipped industrial ETX CPU card

Features ■ Equipped with Atom E3845 1.91GHz CPU ■ DDR3L SO-DIMM x 1 (up to 4GB) ■ LVDS and 1 x DDI signal ■ Watchdog timer, LPC to ISA ■ Extended operating temperature -40 to 85℃ supported

  • Embedded Board Computers
  • CPU Module

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Portwell COM Express PCOM-B219VG

COM Express CPU module equipped with Core i7/i5/i3.

Features ■ Supports Core i7/i5/i3 mobile processors ■ PCI Express x1 7 lanes available on the carrier board (4 lanes can be aggregated to x4) ■ Multi-display support via DisplayPort/HDMI/DVI ■ DDR3 1333/1600 SDRAM (up to 16GB; ECC supported)

  • Embedded Board Computers
  • Evaluation Board
  • CPU Module

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COMExpress CPU Module IBASE ET930

2nd/3rd generation Core i3/Celeron equipped CPU module

Features ■ 2nd/3rd Gen Core i3/Celeron ■ DDR3 SO-DIMM x 2 (up to 16GB) ■ Equipped with VGA, DisplayPort, DVI-I, and 24-bit single channel LVDS ■ Includes watchdog timer and digital I/O

  • Embedded Board Computers
  • CPU Module

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IBASE COM Express CPU Module ET950

4th generation Core i7-4700EQ/i5-4400E/i3-4100E CPU equipped, COM Express CPU module.

Features ■ Equipped with 4th generation Core i7-4700EQ 2.4GHz / i5-4400E 2.7GHz / i3-4100E 2.4GHz CPU ■ DDR3 SO-DIMM (Non-ECC) x 2 (up to 16GB) ■ Triple display output, supporting DisplayPort/DVI-I/DVI-D/24-bit single channel LVDS

  • Embedded Board Computers
  • CPU Module

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IBASE COM Express CPU Module ET860

Equipped with Atom E3845 1.91GHz/E3827 1.75GHz CPU, COM Express CPU module.

Features ■ Equipped with Atom E3845 1.91GHz/E3827 1.75GHz CPU ■ DDR3 SO-DIMM (Non-ECC) x 2 (maximum 8GB) ■ Dual display output, supports DisplayPort/CRT/24-bit single channel LVDS ■ Extended operating temperature range -40 to 85℃

  • Embedded Board Computers
  • CPU Module

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IBASE COM Express CPU Module ET960

Equipped with 5th generation Core i7-5850EQ 2.7GHz/i7-5700EQ 2.6GHz CPU.

Features ■ Equipped with 5th generation Core i7-5850EQ 2.7GHz/i7-5700EQ 2.6GHz CPU ■ DDR3L SO-DIMM (Non-ECC) x 2 (up to 16GB) ■ Triple display output, supporting DisplayPort/DVI-I/DVI-D/24-bit single channel LVDS

  • Embedded Board Computers
  • CPU Module

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Portwell CPU Module PCOM-B637VG

Socket LGA1151 6th generation Core i7/i5/i3 Skylake-S compatible CPU module new

Features ■ Supports 6th generation Core i7/i5/i3 Skylake-S processors (LGA1151) ■ DDR4-2133 ECC/Non-ECC SODIMM x 1 (up to 16GB) ■ Supports VGA, LVDS/eDP, 2x DDI (DP/HDMI/DVI) displays (carrier board) ■ PCI Express 3.0 [x16] x 1 (carrier board)

  • Embedded Board Computers
  • Evaluation Board
  • CPU Module

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Portwell CPU Module PCOM-B639VG

6th generation Core i7/i5/i3/Celeron Skylake-H equipped CPU module new

Features ■ Type 6 COM Express module ■ Equipped with 6th generation Core i7/i5/i3/Celeron Skylake-H processors ■ DDR4-2133 ECC/Non-ECC SODIMM x 2 (up to 32GB) ■ Supports VGA, LVDS/eDP, 2x DDI (DP/HDMI/DVI) displays (carrier board) ■ PCI Express Gen3 compatible (carrier board)

  • Embedded Board Computers
  • Evaluation Board
  • CPU Module

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ADLINK SMARC CPU Module LEC-AL

Equipped with Pentium N4200/Celeron N3350/Atom E3950/E3940/E3930 CPU

Features ■ Equipped with Pentium N4200/Celeron N3350/Atom E3950/E3940/E3930 CPU. ■ Onboard memory 1867MHz DDR3L (up to 8GB) ■ Supports dual channel LVDS (18/24-bit), HDMI/DP++, DP++, and three independent display outputs. ■ 2x MIPI CSI camera (2/4 lanes) ■ 1x GbE with IEEE1588, 1x SATA 3.0, onboard eMMC ■ Extended operating temperature: -40℃ to +85℃ (optional)

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
  • CPU Module

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SECO COM Express CPU Module OBERON

COMe-C08-BT6, Type6 9th/8th Gen Core i7/i5/i3/Xeon

Features ■ 8th Gen Core/Xeon (Coffee Lake) & 9th Gen Core/Xeon/Celeron CPUs (Coffee Lake Refresh) ■ Gigabit Ethernet, 4x USB 3.0; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x16 Gen3 ■ Intel UHD Graphics 630/P630 architecture, up to 48 Execution Units ■ Two DDR4 SO-DIMM Slots supporting DDR4-2666 ECC Memory, up to 64GB

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
  • CPU Module

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SECO COM Express CPU Module LARISSA

COMe-C55-CT6, Type 6 Compact 8th Gen Core i7/i5/i3/Celeron U Series

Features ■ 8th generation Intel Core and Celeron 4000 series processors (formerly Whiskey Lake) with 15W TDP ■ 4 x USB 3.1; 8 x USB 2.0, up to 8 x PCI-e x 1 ■ Intel UHD Graphics 620 / 610 ■ 2×DDR4 SO-DIMM slots (supports up to 64GB of DDR4-2400 memory)

  • Embedded Board Computers
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  • Image Processing Board
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SECO COM Express CPU Module ECHO

COMe-953-BT6, Type 6 4th Gen Core i7/i5/i3/Celeron E Series

Features ■ COM Express Basic Size Type 6 ■ Intel Haswell family CPU ■ 4x USB 3.0; 8x USB 2.0; 7x PCI-e x1 ■ Integrated Intel HD Graphics 4600 ■ 2x DDR3L-1600 maximum 16GB

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
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SECO COM Express CPU Module CHARON

Type6 Compact AMD Ryzen Embedded V1000, AMD Ryzen Embedded V1000 Processor

Features ■ Adopts COM Express Compact Type 6 module ■ 4x USB 3.0; 8x USB 2.0; 4x PCI-e x1 Gen 3, PEG x8 Gen 3 ■ Supports AMD Radeon Vega GPU DirectX 12 with up to 11 computing units ■ Supports up to two DDR4 SO-DIMM slots for DDR4-3200 ECC memory

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
  • CPU Module

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SECO COM Express CPU Module METIS

COMe-C89-CT6, Type 6 Compact AMD Ryzen Embedded R1000 Series Processor

Features ■ Adopts COM Express Compact Type 6 module ■ 4x USB 3.0; 8x USB 2.0; Up to 5x PCI-e x1; PEG x4 Gen3 ■ Equipped with AMD Radeon Vega GPU with three computing units ■ Two DDR4 SO-DIMM slots supporting DDR4-2400 ECC memory

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
  • CPU Module

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SECO μQseven CPU Module ELECTRA

μQ7-C72, μQseven NXP i.MX 8M Mini/Nano, ARM Cortex-A53

Features ■ Supports NXP i.MX 8M Mini Family / i.MX 8M Nano Family ■ Gigabit Ethernet; optional Wi-Fi + BT 5.0; 2 x UART; optional CAN; 5 x USB 2.0; supports 1 PCI-e x1 ■ GC3202D accelerator + GCNanoUltra3D accelerator ■ Onboard DDR4-2400 with a maximum of 4GB memory ■ Operating temperature 0 to 60℃ (optional: -30℃ to 85℃) ■ Dimensions: 40 x 70 mm (μQseven, 1.57” x 2.76”) ■ OS Linux/Yocto

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
  • CPU Module

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SECO CPU Module Trizeps VIII Mini

Trizeps SODIMM-200 CPU module, NXP i.MX 8M Mini family

Features ■ Equipped with NXP i.MX 8M Mini application processor ■ Supports 1x Gigabit Ethernet, WiFi/Bluetooth, USB 2.0, LVDS ■ GC3202D accelerator + GCNanoUltra3D accelerator ■ Onboard LPDDR4-3200 memory up to 8GB ■ Operating temperature 0 to 70℃ (optional: -40℃ to 85℃) ■ Dimensions: 67.6 x 36.7 x 6.4 mm ■ OS Win10 IoT/Debian/Yocto/Android

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
  • CPU Module

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SECO Industrial CPU Module Trizeps VII

Trizeps SODIMM-200 CPU module (size 67.6x36.7mm), NXP i.MX M6 family

Features ■ Equipped with NXP i.MX6 application processor (from Solo to QuadCore) ■ Supports 1x 100/1000 Megabit Ethernet, WiFi/Bluetooth, USB 2.0, PCIe, HDMI ■ Vivante GC3500 2D accelerator + Vivante GC2000 3D accelerator ■ Onboard LPDDR3-1066 memory up to 2GB ■ Operating temperature 0 to 70°C (optional: -40°C to 85°C) ■ Dimensions: 67.6 x 36.7 x 6.4 mm ■ Compatible with OS Win10 IoT/Ubuntu/Android

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
  • CPU Module

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SECO Industrial CPU Module Trizeps VII SX

Trizeps SODIMM-200 CPU module, NXP i.MX 6SoloX, ARM Cortex-A9

Features ■ Equipped with NXP i.MX 6SoloX, single-core Cortex-A9@1GHz + Cortex-M4 core@227MHz processor ■ Supports 2x Fast Ethernet, WiFi/Bluetooth, USB 2.0, PCIe ■ Vivante GC400T, 2D and 3D hardware accelerator ■ Onboard LPDDR3-533 with up to 2GB memory ■ Operating temperature 0 to 70℃ (optional: -40℃ to 85℃) ■ Dimensions: 67.6 x 36.7 x 6.4 mm ■ Compatible with Win Embedded Compact 2013/7/Linux

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
  • CPU Module

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SECO SMARC CPU Module LEVY (SM-D18)

NXP i.MX 8M Plus Family, ARM Cortex-A53, size 50x82mm

Features ■ Equipped with NXP i.MX8MPlus application processor ■ 2x Gigabit Ethernet; optional Wi-Fi + BT 5.0; 2x CSI camera; 2x USB 3.0; 3x USB 2.0; 1x PCI-e x1; 2x CAN Bus; 4x UART; 14x GPIOs; supports QuadSPI interface ■ Integrated GPU supporting three independent displays ■ Onboard LPDDR4-4000 with up to 6GB memory ■ Operating temperature 0 to 60°C (optional: -40°C to 85°C) ■ Size: 50 x 82 mm (1.97” x 3.23”) ■ Compatible with Linux OS

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
  • CPU Module

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SECO Qseven CPU Module ATLAS

Pentium J/N6000/Atom x6000E series, equipped with onboard LPDDR4-3200 with a maximum of 16GB.

Features ■ Equipped with Intel Atom x6000E series and Intel Pentium and Celeron N and J series processors ■ 1x GbE with precision time protocol IEEE 1588, 6x USB 2.0, 2x SuperSpeed USB 10Gbps, supports up to 4x PCI-e ■ Integrated Intel Gen 11 UHD graphics controller with up to 32 EU ■ Onboard LPDDR4-3200 memory with a maximum of 16GB ■ Operating temperature 0 to 60°C (optional: -40°C to 85°C) ■ Dimensions: 70 x 70 mm (2.76” x 2.76”) ■ OS Win10 IoT/Yocto

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
  • CPU Module

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SECO Qseven CPU Module ASTERION

Celeron J1900/N2x00/Atom E3800 series, onboard DDR3L-1333 with a maximum of 8GB memory.

Features ■ Supports Intel Atom E3800 and Celeron family ("Bay Trail") ■ 6x USB 2.0; 1x USB 3.0; 3x PCI-e x1 ■ Integrated Intel HD Graphics 4000 Series controller ■ Onboard DDR3L-1333 with a maximum of 8GB memory ■ Operating temperature 0–60℃ (optional: -40–85℃) ■ Dimensions: 70x70 mm (2.76” x 2.76”) ■ OS Win10/8.1/7/Linux/Yocto

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
  • CPU Module

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SECO COM-HPC CPU Module ORION

12th Core i series, 2xDDR5-4800 maximum 64GB memory, size 120x95mm

Features ■ Supports 12th generation Intel Core processors (Codename: Alder Lake – H series) ■ 2x 2.5GbE; 4x USB4 Gen 2x2; 4x USB2.0; 8x PCIe x1 Gen3, 1x PCIe x8 or 2x PCIe x4 Gen4; Optional on-board WiFi 6E + BT 5.2 ■ Intel Iris Xe Architecture with up to 96 EUs, up to 4 independent displays ■ Supports 2xDDR5-4800 memory up to 64GB ■ Operating temperature 0–60℃ (Optional: -40–85℃) ■ Dimensions: 120x95mm ■ OS Win Server2022/VxWorks7.0/Ubuntu/Linux/Yocto/Android

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
  • CPU Module

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SECO COM-HPC CPU Module LAGOON

11th Xeon W-11000E/Core i series, equipped with 2xDDR4-3200 ECC, maximum 64GB memory.

Features ■ Supports 11th generation Intel Xeon, Core, and Celeron processors ■ 2x USB 4; 2x USB 3.2 Gen 2x2; 8x USB 2.0; 20x PCI-e Gen3 lanes; 20x PCI-e Gen4 lanes; supports up to 2x 2.5GbE ■ Intel Iris Xe Graphics Core Gen12 GPU with up to 32 EU, supports up to 4 independent displays ■ Equipped with 2x DDR4-3200 ECC memory, maximum 64GB ■ Operating temperature 0 to 60℃ (optional: -40 to 85℃) ■ Dimensions: 120x95mm ■ OS: Win10 IoT/Linux/Yocto/VxWorks7.0/Android

  • Embedded Board Computers
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  • Image Processing Board
  • CPU Module

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SECO ETX CPU Module ETX-A61

Celeron J1900/N2x00/Atom E3800 series, onboard DDR3L-1333 with a maximum of 8GB memory.

Features ■ Supports Intel Atom E3800 and Celeron families ■ Compatible with PCI Bus 2.3; ISA Bus; LPT; PS/2 ■ Integrated Intel HD graphics 4000 Series controller with dual independent display support ■ Onboard DDR3L-1333 memory, up to 8GB ■ Operating temperature: 0 to 60°C ■ Dimensions: 114x95 mm (4.49” x 3.74”) ■ OS: Win10/8.1/7/Linux/Yocto

  • Embedded Board Computers
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  • Image Processing Board
  • CPU Module

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12th COM Express CPU Module Type 6

12th Gen Core i7-12800HE/i5-12600HE/i3-12300HE, 2xDDR5 up to 64GB

【ADLINK Express-ADP Features】 ■ 12th Generation Intel Core Processor ■ Up to 14 cores (6 P-cores, 8 E-cores), 20 threads ■ Intel AVX-512 VNNI, Intel DL Boost ■ Intel Iris Xe Graphics, 4x 4K display ■ Capable of displaying 4 screens simultaneously at 4K60 HDR ■ 4K display via DDI, eDP 1.4b, USB4, and TBT4 ■ Up to 64GB DDR5 (up to 4800 MT/s) ■ 16x PCIe Gen4, 5x PCIe Gen3 lanes ■ 2.5GbE, TSN compatible ■ 4x USB 3.x/2.0 and 4x USB 2.0 ■ 2x SATA ■ NVMe SSD support

  • Embedded Board Computers
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OSM CPU Module ADLINK OSM-MTK510

MediaTek Genio 510 SoC 2x Arm Cortex-A78 & 4x A55, LPDDR4 up to 4GB

【ADLINK OSM-MTK510 Features】 ■Dimensions: 45mm x 45mm ■Equipped with Genio 510 (Dual-core Cortex-A78 + Quad-core Cortex-A55) ■Includes Ethos U-VP6 AI processing unit ■Graphic output interfaces: HDMI/DisplayPort (DP), eDP, DSI ■LPDDR4 up to 4GB ■eMMC up to 128GB ■1x USB 3.0, 2x USB 2.0, 4x UART, 3x SPI, 2x I²S interfaces, 3x I²C interfaces, 17x GPIO ■RGMII LAN MAC interface supporting 10/100/1000 Mbps ■Complies with IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D

  • スクリーンショット 2025-10-24 153342.png
  • Embedded Board Computers
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OSM CPU Module ADLINK OSM-IMX8MP

ADLINK, NXP i.MX8M Plus with 4-core Cortex-A53 & M7, LPDDR4L up to 8GB

【ADLINK OSM-IMX8MP Features】 ■Dimensions: 45mm x 45mm ■NXP i.MX8M Plus series (4-core Cortex-A53 + Cortex-M7) ■Equipped with TrustZone technology supporting Armv8 cryptographic functions ■2.3 TOPS Neural Processing Unit (optional) ■Graphic output interfaces: HDMI, LVDS, DSI ■LPDDR4L up to 8GB ■eMMC up to 128GB ■2x USB 3.0, 2x USB 2.0, 2x CAN2.0, 4x UART, 3x SPI, 1x I²S interface, 2x I²C interfaces, 8x GPIO ■Dual GbE (one port supports TSN) ■Supports extended temperature range -40°C to 85°C ■Complies with IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D

  • スクリーンショット 2025-10-24 161946.png
  • Embedded Board Computers
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